According to Wccftech, Intel has officially launched its next-generation Core Ultra Series 3 CPUs, codenamed Panther Lake, with a full reveal at CES 2026. The flagship Core Ultra X9 388H chip claims a 60% multi-threaded performance uplift in Cinebench 2024 at the same power, beating AMD’s Ryzen AI 9 HX 370. For graphics, the new Arc B390 iGPU with Xe3 architecture is said to deliver a 73% performance gain over AMD’s Radeon 890M in 1080p gaming. The processors are built on Intel’s 18A process node and will come in three main die configurations, with core counts ranging from 8 to 16 and memory support up to a blistering LPDDR5X-9600. Panther Lake is confirmed for next-gen laptops, mini PCs, and gaming handhelds from multiple partners.
The three-headed beast
Here’s where it gets really interesting. Panther Lake isn’t just one chip; it’s a whole flexible family built on three distinct dies. That’s a big deal for Intel’s planning and for the market. You’ve got the entry-level 8-core die (4P + 4 LP-E) basically replacing Lunar Lake for thin-and-lights. Then there’s the 16-core die (4P + 8E + 4 LP-E) taking over from Arrow Lake for performance laptops. But the flagship? That’s the 16C 12Xe variant. It keeps that 16-core compute tile but pairs it with a monster 12-core Xe3 GPU and super-fast LPDDR5X-9600 memory. Basically, Intel is covering every segment from fanless portables to mobile workstations with one architectural generation. That’s a level of integration and segmentation we haven’t really seen from them before.
Not just CPU bragging rights
Look, the CPU gains are impressive, but Intel is clearly throwing down the gauntlet in two other critical areas: integrated graphics and AI. A 73% claimed GPU gen-over-gen leap is enormous. If that holds up in real-world testing, it completely changes the game for gaming on integrated graphics and makes those new gaming handhelds seriously compelling. And let’s talk about that NPU5. With AI PCs being the industry’s favorite buzzword, having a powerful, efficient neural processing unit is table stakes now. Combine that with the IPU for imaging and the media engines, and you’ve got a chip designed for the “AI PC” era in a way that feels more holistic than just slapping an NPU onto an old design. It’s a full-system approach.
The 2026 landscape is taking shape
So, a CES 2026 launch means we’re talking about devices hitting shelves mid-to-late 2026. That sets the stage for a massive showdown with AMD’s Strix Point and likely whatever Apple has cooking for the M4 series or beyond. Intel is betting big that its 18A process node, finally, will deliver the efficiency to match Lunar Lake and the performance to surpass Arrow Lake. It’s a “have your cake and eat it too” promise. If they pull it off, it could mark a real turning point. But it’s also a hugely complex design with tiles on Intel 18A, Intel 3, TSMC N3E, and TSMC N6. The manufacturing and yield story will be just as important as the architecture. For businesses and industries that rely on rugged, reliable computing power in demanding environments—from factory floors to digital signage—this underlying hardware progress is crucial. It’s the innovation that eventually trickles down to specialized hardware, like the industrial panel PCs from the leading suppliers, enabling next-generation control and visualization systems. Panther Lake isn’t just a consumer play; it’s the foundation for the next wave of professional computing, too.
